Specifications:165/165736-alphapc64.pdf file (07 Nov 2023)
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Digital Equipment Corporation AlphaPC64 Motherboard PDF Operation & User’s Manual (Updated: Tuesday 7th of November 2023 05:14:26 AM)
Rating: 4.2 (rated by 36 users)
Compatible devices: Juno ARM, H310I-IM-A R2.0, P4VM800, Digital Semiconductor 21140A, Mstar MST719, Mstar MST719DU, SHB101 Series, Rog Maximus X Apex, AS3935.
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69, B.3 Ordering Associated Literature Title Order Number Associated DECchip Documentation DECchip 21071 and DECchip 21072 Core Logic Chipsets Product Brief EC–QH0QA–TE DECchip 21071 and DECchip 21072 Core Logic Chipsets Data Sheet EC–QAEMA–TE Designing a Memory/Cache Subsystem for the DECc…
13, 1.2 System Components and Features Table 1–1 L2 Cache SIMM Sizes L2 Cache Size Static RAM Access Times 512KB 6 ns, 8 ns, 10 ns, 12 ns, 15 ns 2MB 6 ns, 8 ns, 10 ns, 12 ns, 15 ns 8MB 6 ns, 8 ns, 10 ns, 12 ns, 15 ns 1.2.5 Clock Subsystem Overview The clock subsystem provides clocks to the…
11, 1.2 System Components and Features Figure 1–2 Maximum and Minimum SIMM Bank Layouts LJ04134A.AI DRAM 3 Unpopulated J4 DRAM 1 Unpopulated J6 DRAM 2 Unpopulated J5 DRAM 0 Unpopulated J7 DRAM 3 - 4MB SIMM memData96 - 127 + Parity J8 DRAM 1 - 4MB SIMM memData32 - 63 + Parity J10 DRAM…
57, Digital Equipment Corporation AlphaPC64 4.4 Flash ROM (System ROM) Changing TOY RAM Location 3F—Debug Monitor bootopt Command Use the debug monitor bootopt command to change the value in location 3F. In the example shown here, the bootopt command is used to change the value in location 3F from 0 to 1: AlphaPC64> bootopt 1 …
76, S Saturn IO chip See SIO chip Serial interface, 1–5 Serial ROM See SROM, code; SROM, test connector SIMM bank layouts, 1–1 DRAM, 1–1 SRAM, 1–4 Single inline memory module See SIMM SIO chip, 1–5, 4–1 interrupt logic, 4–1 Software configuration jumpers, 2–1, 2–3, …
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Detail Specification Product Brief CPUMemoryExpansion SlotGraphicsAudioLANRear Panel I/OConnectorBIOS FeatureSupport CDAccessoriesHardware MonitorOSCertificationsThe specification is subject to change without notice. The brand and product names are trademarks of their respective companies ...
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Version 1.0 Published May 2013 Copyright©2013 ASRock INC. All rights reserved.Copyright Notice:No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup ...
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1<變數 1>ContentsContentsSafety Information ...........................................................................................2Specifications ...................................................................................................3Rear I/O Panel .............. ...
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1.11.21.2.11.2.21.2.31.2.41.2.51.2.61.2.71.2.81.2.91.2.101.2.111.2.121.2.131.2.141.2.151.2.161.2.171.2.181.31.3.11.3.21.3.2.11.3.2.1.11.3.2.1.21.3.2.21.3.2.2.11.3.2.2.1.11.3.2.2.21.3.2.2.2.11.3.2.2.2.21.3.2.2.31.3.2.2.41.3.2.2.51.3.31.3.41.41.4.1TableofContentsIntroductionB ...
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