Specifications:222/222372-memory_bus_interface_type.pdf file (13 Feb 2024)
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TDK Memory Bus Interface Type Network Card PDF Specification Sheet (Updated: Tuesday 13th of February 2024 06:38:20 AM)
Rating: 4.8 (rated by 69 users)
Compatible devices: DEA Series DEA252450BT-7012D1, DEA Series DEA162500LT-1217A1, CF Series CF61A700, HHM Series HHM2411, SI-300, HHM Series HHM1727D1, HHM Series HHM1711E1, Powereta iQP Series.
Recommended Documentation:
(1/1) 001-04 / 20070219 / ew_004.fm • All specifications are subject to change without notice. NAND-type Flash Memory Controller IC GBDriver XR Memory Bus Interface Type For Small Embedded Systems without an ATA/IDE interface NAND-type Flash Memory has occupied significant place in embedded systems. In many cases the system size is small and an ATA interface is not used. The TDK GBDriver XR bridges those host interfaces without an ATA bus to NAND-type Flash Memory. The built-in engine is the TDK GBDriver RA3 controller. The GBDriver RA3 is the recipient of numerous design wins and strong interest from our customer base. GBDriver XR interfaces with a common memory bus such as SRAM bus, enabling CPU to connect with and thus control NAND-type Flash Memory directly. GBDriver XR makes it possible to build storage systems even if they do not have hard disk interface such as ATA/ IDE. The XR is packaged in an ultra-small, ultra-thin VFBGA. This simplifies insertion into portable devices, mobile terminals, and small IT home appliances. FEATURES • World’s first NAND-type Flash Memory controller interfacing with common memory bus, such as a one chip LSI solution. • Realizes 6MB/s burst writes when directly connected with the system bus. • Controls NAND-type Flash Memory up to 4GB. Confirmed compatibility with Flash Memories of several makers. ∗ • High reliability in Write and Read by TDK original systematic control over NAND-type Flash Memory. • ATA compatible register interface, suitable for use with the FAT file system, only low level driver required. • Available in 8mm VFBGA100pin package. • Supports auto recovery function (option) • Conforms to the RoHS directives. ∗ Please contact us to confirm the Flash Memory compatibility. MAIN APPLICATIONS • Flash memory modules • Silicon storage • Boot devices for embedded systems APPLICATIONN EXAMPLES • For NOR Flash-/HDD- replacement applications. • For user data storage applications; home information appliances, STBs, PDAs, mobile phones, etc. • For booting embedded systems of WindowsXP Embedded-base or Linux-base. SHAPES AND DIMENSIONS VFBGA100pin Single Chip SPECIFICATIONS Conformity to RoHS Directive Timing specifications Host I/F 120ns[Burst cycle] 180ns[Single cycle] Flash I/F 90ns Power specifications Host I/F 2.7 to 3.6V Core 2.7 to 3.6V Flash I/F 2.7 to 3.6V System clock 33.33MHz [External clock support] Temperature ranges Operating –40 to +85°C Storage –55 to +125°C Power consumption (ref.) Reading 41mA[3.0V] Writing 40mA[3.0V] 8.0 ø0.25 0.38 6.75 0.75 8.00.18 to 0.28 1.0max. 6.75 Dimensions in mm C Solder ball Detail of ball 1098765432112345678910 A B C D E F G H J K A B C D E F G H J K A1 corner marking A1 corner marking 0.10 C 100-ø0.25 to 0.35 Land & lead Solder resist Substrate Opening size • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • GBDriver is a registered trademark of TDK Corporation • CompactFlash TM is a trademark of SanDisk Corporation
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