Cypress CY62146DV30 Manual, Specification Sheet

Manual, Specification Sheet for Cypress CY62146DV30 Computer Hardware (11 pages)

Specifications:

126/126192-cy62146dv30.pdf file (27 Mar 2024)
  • Manufacturer: Cypress
  • Category of Device: Computer Hardware
  • Document: CY62146DV30, File Type: PDF Specification Sheet
  • Updated: 27-03-2024
  • Count of Pages: 11
Download CY62146DV30 Manual (11 pages)

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Data: UPD 27th March 2024

Cypress CY62146DV30 Computer Hardware PDF Specification Sheet (Updated: Wednesday 27th of March 2024 03:59:06 PM)

Rating: 4.6 (rated by 56 users)

Compatible devices: MB91460, CY62138EV30, CY8CKIT-017, CY4541 EZ-PD CCG4 Evaluation Kit, CY3273, CY8CKIT-030, CY62138FV30, CY14E256L.

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Text Version of Cypress CY62146DV30 Computer Hardware Manual (Summary of Contents)

(Ocr-Read of Cypress CY62146DV30 Document (Main Content), UPD: 27 March 2024)

  • 7, CY62146DV30 Document #: 38-05339 Rev. *A Page 7 of 11 Write Cycle No. 1 (WE Controlled) [15, 19, 20] Write Cycle No. 2 (CE Controlled) [15, 19, 20] Notes: 19. Data I/O is high impedance if OE = V IH . 20. If CE goes HIGH simultaneously with WE = V IH , the output remains in a high-impedance s…

  • 8, CY62146DV30 Document #: 38-05339 Rev. *A Page 8 of 11 Write Cycle No. 3 (WE Controlled, OE LOW) [20] Write Cycle No. 4 (BHE/BLE Controlled, OE LOW) [20] Switching Waveforms (continued) DATA IN t HD t SD t LZWE t PWE t SA t HA t AW t SCE t WC t HZWE CE ADDRESS WE DATAI/O NOTE 21 t BW BHE/BLE …

  • 9, CY62146DV30 Document #: 38-05339 Rev. *A Page 9 of 11 Truth Table CE WE OE BHE BLE Inputs/Outputs Mode Power H X X X X High Z Deselect/Power-Down Standby (I SB ) L X X H H High Z Output Disabled Active (I CC ) L H L L L Data Out (I/O O –I/O 15 ) Read Active (I CC ) L H L H L Data Out…

  • 10, Cypress CY62146DV30 CY62146DV30 Document #: 38-05339 Rev. *A Page 10 of 11 © Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embo…

  • 2, CY62146DV30 Document #: 38-05339 Rev. *A Page 2 of 11 Notes: 2. NC pins are not internally connected on the die. 3. DNU pins have to be left floating or tied to V SS to ensure proper application. 4. Pins H1, G2, and H6 in the BGA package are address expansion pins for 8 Mb, 16 Mb, …

  • 4, CY62146DV30 Document #: 38-05339 Rev. *A Page 4 of 11 Capacitance (for all packages) [9] Parameter Description Test Conditions Max. Unit C IN Input Capacitance T A = 25°C, f = 1 MHz, V CC = V CC(typ) 10 pF C OUT Output Capacitance 10 pF Thermal Resistance [9] Parameter Description Test Cond…

DOC-ea84e057:

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